Development of an advanced thermal interface material for high power devices


The cure reactions for conventional flexible epoxy resins are generally slow and have out-gassing and branching site reactions. As a result, these resin types have significant hardening after long-term, high-temperature exposure which makes them unsuitable for thermal interface applications. To address these challenges, a new epoxy resin system has been… (More)

11 Figures and Tables


  • Presentations referencing similar topics