Development of a thermal resistance model for chip-on-board packaging of high power LED arrays

@article{Ha2012DevelopmentOA,
  title={Development of a thermal resistance model for chip-on-board packaging of high power LED arrays},
  author={Minseok Ha and Samuel Graham},
  journal={Microelectronics Reliability},
  year={2012},
  volume={52},
  pages={836-844}
}
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