Development of Bump Support Film (BSF) for expanding the size of WLCSP

@article{Yamagishi2015DevelopmentOB,
  title={Development of Bump Support Film (BSF) for expanding the size of WLCSP},
  author={Masanori Yamagishi and Shinya Takyu and Naoya Saiki and Akinori Sato and Rey Alvarado},
  journal={2015 IEEE CPMT Symposium Japan (ICSJ)},
  year={2015},
  pages={29-32}
}
Solder joint crack is increasing with increasing of warpage caused by larger Wafer Level Chip Size Package (WLCSP). In this study, we studied new Bump Support Film (BSF) made of back grind tape and thermosetting epoxy resin, which covers the bottom of bumps by heat lamination. We succeeded to form the BSF without voids at the bottom of the bumps by… CONTINUE READING