Development and application of a micro-infrared photoelasticity system for stress evaluation of through-silicon Vias (TSV)

@article{Su2015DevelopmentAA,
  title={Development and application of a micro-infrared photoelasticity system for stress evaluation of through-silicon Vias (TSV)},
  author={Fei Su and Tianbao Lan and Xiaoxu Pan and Zheng Zhang},
  journal={2015 IEEE 65th Electronic Components and Technology Conference (ECTC)},
  year={2015},
  pages={1789-1794}
}
The through-Silicon-Vias (TSV) is a key component of three dimensional electronic packaging, knowing its stresses is very important for its reliability evaluation. In this paper, we evaluated the stress of TSV during thermal cycling with a micro-infrared photoelasticity system in full field and real time measurement mode, three important findings are… CONTINUE READING