Development and Characterization of Surface Micromachined , Out-of-Plane HotWire Anemometer

@inproceedings{Chen2001DevelopmentAC,
  title={Development and Characterization of Surface Micromachined , Out-of-Plane HotWire Anemometer},
  author={Jack Chen and Chang Liu},
  year={2001}
}
In this paper, we report the development of a new type of hot-wire anemometer (HWA) realized by using a microfabrication process that combines surface micromachining and an efficient three-dimensional assembly technique. The HWA uses a thermal element (hot wire) that is made of Pt/Ni/Pt film with a measured temperature coefficient of resistance (TCR) of 2400 ppm/ C. The thermal element is elevated out of plane by using support beams made of polyimide. In our current design, the support beam is… CONTINUE READING
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