Determination of migration effects in Cu-via structures with respect to process-induced stress

@article{WeideZaage2008DeterminationOM,
  title={Determination of migration effects in Cu-via structures with respect to process-induced stress},
  author={Kirsten Weide-Zaage and Jiani Zhao and Joharsyah Ciptokusumo and Oliver Aubel},
  journal={Microelectronics Reliability},
  year={2008},
  volume={48},
  pages={1393-1397}
}