Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals

@article{Zhang2006DetectionOF,
  title={Detection of flip chip solder joint cracks using correlation coefficient and auto-comparison analyses of laser ultrasound signals},
  author={Lizheng Zhang and I. Charles Ume and J. Gamalski and K.-P. Galuschki},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2006},
  volume={29},
  pages={13-19}
}
The detection of cracks in solder joints has been a challenge for the current nondestructive inspection techniques. This paper investigates the capability of a laser ultrasound and vibrometer inspection system to detect thermal cycle induced cracks in flip chip solder joints. Correlation coefficient analysis of ultrasound vibration signals is presented and compared with the previous error ratio method. The correlation coefficient method improves the system's signal-to-noise ratio. Optimum… CONTINUE READING
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