Designing to Digital Wireless Specifications Using Circuit Envelope Simulation

@inproceedings{Yap1998DesigningTD,
  title={Designing to Digital Wireless Specifications Using Circuit Envelope Simulation},
  author={H. Y. Yap and HP EEsof},
  year={1998}
}
Circuit Envelope is a circuit simulation technology developed specifically to simulate modern wireless circuits with complex digitally modulated RF signals such as CDMA and TDMA. In this paper, Circuit Envelope technology is explained and is contrasted with Spice and harmonic balance simulators. Applications of Circuit Envelope are then demonstrated in the simulation of phase-locked loops (PLL); amplifier adjacent channel power ratio (ACPR) and noise power ratio (NPR); and IQmodulator error… CONTINUE READING
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