Designing to Digital Wireless Specifications Using Circuit Envelope Simulation

  title={Designing to Digital Wireless Specifications Using Circuit Envelope Simulation},
  author={H. Y. Yap and HP EEsof},
Circuit Envelope is a circuit simulation technology developed specifically to simulate modern wireless circuits with complex digitally modulated RF signals such as CDMA and TDMA. In this paper, Circuit Envelope technology is explained and is contrasted with Spice and harmonic balance simulators. Applications of Circuit Envelope are then demonstrated in the simulation of phase-locked loops (PLL); amplifier adjacent channel power ratio (ACPR) and noise power ratio (NPR); and IQmodulator error… CONTINUE READING
Highly Cited
This paper has 17 citations. REVIEW CITATIONS


Publications citing this paper.
Showing 1-10 of 14 extracted citations


Publications referenced by this paper.
Showing 1-9 of 9 references

Designer’s Task Ref. Vol. 4, Circuit Envelope Simulation

  • HP EEsof MDS Manual, v7.0
  • July 1996
  • 1996
1 Excerpt

Designing Communications Circuits To New Digital Wireless Standards

  • Yap
  • Wireless Systems Design, September 1996.
  • 1996
1 Excerpt

RF and Microwave Circuit Design for Wireless Communications

  • Larson
  • Artech House, 1996
  • 1996
1 Excerpt

Software Advances Aid in Simulating PLL- Based Circuits

  • Howard
  • MW & RF, September 1996.
  • 1996
1 Excerpt

The Mobile Communications Handbook

  • Gibson
  • CRC Press, 1996
  • 1996
1 Excerpt

Circuit Envelope Simulator Technical Seminar

  • Howard, Yap
  • HP EEsof, 1995
  • 1995
1 Excerpt

HP EEsof Product Note 85150-6, Sharing Data Between the Microwave Design System and OmniSys/CDS

  • Pleasant
  • 1995
  • 1995
1 Excerpt

Steady- State methods for Simulating Analog and Microwave Circuits

  • Kundert, White, Sangiovanni-Vincentelli
  • Kluwer Academic Publishers, 1990
  • 1990
1 Excerpt

New Method of analysis of Communication Systems

  • Sharrit
  • MTTS’96 WMFA: Nonlinear CAD Workshop, June 96
1 Excerpt

Similar Papers

Loading similar papers…