Design specific variation in pattern transfer by via/contact etch process: full-chip analysis

  title={Design specific variation in pattern transfer by via/contact etch process: full-chip analysis},
  author={Valeriy Sukharev and Ara Markosian and Armen Kteyan and Levon Manukyan and Nikolay Khachatryan and Jun-Ho Choy and Hasmik Lazaryan and Henrik Hovsepyan and Seiji Onoue and Takuo Kikuchi and Tetsuya Kamigaki},
  booktitle={Advanced Lithography},
A novel model-based algorithm provides a capability to control full-chip design specific variation in pattern transfer caused by via/contact etch processes. This physics based algorithm is capable of detecting and reporting etch hotspots based on the fab defined thresholds of acceptable variations in critical dimension (CD) of etched shapes. It can be used also as a tool for etch process optimization to capture the impact of a variety of patterns presented in a particular design. A realistic… 
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  • 2010
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