Design optimization for a power package by simulation

@article{Fan2017DesignOF,
  title={Design optimization for a power package by simulation},
  author={Haibo Fan and WW Chow and Pompeo V Umali and Fei Liang Wong and Kai Zhang and Haibin Chen and Jingshen Wu},
  journal={2017 18th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)},
  year={2017},
  pages={1-4}
}
As one of challenges, clip design for bonding area is becoming smaller and smaller to achieve die size requirement, better view inspection and efficient solder flux cleaning. However, with a small bonding area, there will be a concern on high thermal resistance during working condition, especially under a surge current, in which junction temperature may be higher than the melting temperature of soft solder, i.e. 298 °C, resulting in a potential concern of package reliability. Therefore, design… CONTINUE READING