Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics

@inproceedings{LIUXingjun2005DesignOP,
  title={Design of Pb-free solders in electronic packaging by computational thermodynamics and kinetics},
  author={LIUXing-jun and WANGCui-ping and OHNUMAIkuo and KAINUMARyosuke and ISHIDAKiyohito},
  year={2005}
}
Computational thermodynamics and kinetics were used to design the Pb-free micro-solders for replacing the conventional Sn-Pb solders because of the health and environmental safety problem.On the basis of CALPHAD (Calculation of Phase Diagrams) method we can easily calculate properties such as the liquidus projection, isothermal and vertical sectional diagrams and phase fraction in multicomponent system including Ag, Bi, Cu, In, Sb, Sn, Zn and Pb elements. In addition, other related information… CONTINUE READING