Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology

@article{Richter2008DesignO7,
  title={Design of 77 GHz Interconnects for Buried SiGe MMICs Using Novel System-in-Package Technology},
  author={M. Richter and K.-F. Becker and Lars Bottcher and Martin Schneider},
  journal={2008 38th European Microwave Conference},
  year={2008},
  pages={1573-1576}
}
This paper describes the design, simulation and measurement of interconnects of buried active 77 GHz chips to a high frequency substrate using microvia technology. The embedding technology proposed offers great opportunities for a very broad range of frequencies and applications as well as a large potential for cost reduction.