Design method and material technologies for passives in printed circuit Board Embedded circuits

@article{Waffenschmidt2005DesignMA,
  title={Design method and material technologies for passives in printed circuit Board Embedded circuits},
  author={Eberhard Waffenschmidt and Bernd Ackermann and J. A. M. Ferreira},
  journal={IEEE Transactions on Power Electronics},
  year={2005},
  volume={20},
  pages={576-584}
}
The integration of passive components into the printed circuit board (PCB) as embedded passives integrated circuits (emPIC) results in a higher power density of power converters. To achieve a highly automated, low cost, integral manufacturing, the devices are constructed layer wise. Materials and processes necessary for the manufacturing of such circuits are described in this publication. Especially for magnetic components like inductors and transformers the design of such thin components is… CONTINUE READING
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References

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