Design for manufacturability and reliability for TSV-based 3D ICs

@article{Pan2012DesignFM,
  title={Design for manufacturability and reliability for TSV-based 3D ICs},
  author={David Z. Pan and Sung Kyu Lim and Krit Athikulwongse and Moongon Jung and Joydeep Mitra and Jiwoo Pak and Mohit Pathak and Jae-Seok Yang},
  journal={17th Asia and South Pacific Design Automation Conference},
  year={2012},
  pages={750-755}
}
The 3D IC integration using through-silicon-vias (TSV) has gained tremendous momentum recently for industry adoption. However, as TSV involves disruptive manufacturing technologies, new modeling and design techniques need to be developed for 3D IC manufacturability and reliability. In particular, TSVs in 3D IC may cause significant thermal mechanical stress… CONTINUE READING