Design and development of micro-sensors for measuring localised stresses during copper wirebonding

Abstract

In wirebonding, high stresses applied onto the pad during the ultrasonic bonding can result in pad damage, silicon cratering and aluminium splash — all of which ultimately result in poor joint quality. Cracking in the Cu/low-k and Cu/ultra low-k layers beneath the pad (also a result of high applied stresses) is a common issue with wirebonding. As a result… (More)

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