Design and development of micro-sensors for measuring localised stresses during copper wirebonding


In wirebonding, high stresses applied onto the pad during the ultrasonic bonding can result in pad damage, silicon cratering and aluminium splash — all of which ultimately result in poor joint quality. Cracking in the Cu/low-k and Cu/ultra low-k layers beneath the pad (also a result of high applied stresses) is a common issue with wirebonding. As a result… (More)

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