Design and Reliability of a New Wl-csp


A new wafer level package has been designed and fabricated in which the entire package can be constructed at the wafer level using batch processing. Peripheral bondpads are redistributed from the die periphery to an area array using a redistribution metal of sputtered aluminum or electroplated copper and a redistribution dielectric. Redistribution of metal… (More)


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@inproceedings{White2002DesignAR, title={Design and Reliability of a New Wl-csp}, author={Jerry J. White}, year={2002} }