Design and Fabrication of Glass-based Integrated Passive Devices
@article{Sun2018DesignAF, title={Design and Fabrication of Glass-based Integrated Passive Devices}, author={Peng Sun and Yuhong Zhou and Ge Sima and Zhaoqiang Li and Liqiang Cao}, journal={2018 19th International Conference on Electronic Packaging Technology (ICEPT)}, year={2018}, pages={59-63} }
The integrated passive device technology is important to realize high performance, small volume, low cost ant multi-functional integration for wireless RF front-end applications. And glass substrate become more and more popular in passive device fabrication because of its low dielectric loss, high thermal stability, high resistivity, and adjustable Coefficient of Thermal Expansion. In this paper, we have designed and fabricated circular planar inductors and band-pass filter based on our unique…
One Citation
Design and Fabrication of IPD Low-Pass Filter on Silicon Substrate
- Engineering2020 21st International Conference on Electronic Packaging Technology (ICEPT)
- 2020
IPD (Integrated Passive Device) is an important implementation method of SiP(System in Package),which uses more flexible materials and processes to reduce the influence of stray inductance and…
References
SHOWING 1-7 OF 7 REFERENCES
Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
- Physics
- 2001
Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high…
Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
- Engineering, BusinessIEEE Transactions on Advanced Packaging
- 2007
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of…
Comparison and analysis of integrated passive device technologies for wireless radio frequency module
- Business2008 58th Electronic Components and Technology Conference
- 2008
We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of…
Wafer-level chip scale packaging: benefits for integrated passive devices
- EngineeringECTC 2000
- 2000
Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions. The term chip scale package (CSP) has become synonymous with "fine…
Design and Modeling of Inductors, Capacitors and Coplanar Waveguides at Tens of GHz Frequencies
- Physics
- 2014
A comparison of thin film polymers for Wafer Level Packaging
- Materials Science2010 Proceedings 60th Electronic Components and Technology Conference (ECTC)
- 2010
Polymers are a key building block for all WLP and related technologies like IPD (integrated passives devices) and 3D-SiP (system in Package). A couple of different classes of photo-sensitive…
The Study of Design and Integrating for Wafer Level Silicon Passive Devices
- 2015