Design and Fabrication of Glass-based Integrated Passive Devices

  title={Design and Fabrication of Glass-based Integrated Passive Devices},
  author={Peng Sun and Yuhong Zhou and Ge Sima and Zhaoqiang Li and Liqiang Cao},
  journal={2018 19th International Conference on Electronic Packaging Technology (ICEPT)},
  • P. Sun, Yuhong Zhou, Liqiang Cao
  • Published 1 August 2018
  • Engineering
  • 2018 19th International Conference on Electronic Packaging Technology (ICEPT)
The integrated passive device technology is important to realize high performance, small volume, low cost ant multi-functional integration for wireless RF front-end applications. And glass substrate become more and more popular in passive device fabrication because of its low dielectric loss, high thermal stability, high resistivity, and adjustable Coefficient of Thermal Expansion. In this paper, we have designed and fabricated circular planar inductors and band-pass filter based on our unique… 
Design and Fabrication of IPD Low-Pass Filter on Silicon Substrate
IPD (Integrated Passive Device) is an important implementation method of SiP(System in Package),which uses more flexible materials and processes to reduce the influence of stray inductance and


Multilayer thin-film MCM-D for the integration of high-performance RF and microwave circuits
Thin-film multi-layer MCM-D technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high
Fabrication of Application Specific Integrated Passive Devices Using Wafer Level Packaging Technologies
Integrated passives have become increasingly popular in recent years. Especially wafer level packaging technologies offer an interesting variety of different possibilities for the implementation of
Comparison and analysis of integrated passive device technologies for wireless radio frequency module
We have investigated the existing integrated passive device (IPD) technologies for cost effective IPD solutions for discrete radio frequency (RF) module. Based upon the investigation in terms of
Wafer-level chip scale packaging: benefits for integrated passive devices
Chip scale packaging continues to draw attention for applications that require high performance or small form factor solutions. The term chip scale package (CSP) has become synonymous with "fine
A comparison of thin film polymers for Wafer Level Packaging
Polymers are a key building block for all WLP and related technologies like IPD (integrated passives devices) and 3D-SiP (system in Package). A couple of different classes of photo-sensitive
The Study of Design and Integrating for Wafer Level Silicon Passive Devices
  • 2015