Design and Evaluation of a 2D Array PIN Photodiode Bump Bonded to Readout IC for the Low Energy X-ray Detector

@article{Yuk2006DesignAE,
  title={Design and Evaluation of a 2D Array PIN Photodiode Bump Bonded to Readout IC for the Low Energy X-ray Detector},
  author={Sunwoo Yuk and Shin-Woong Park and Yun Yi},
  journal={2006 International Conference of the IEEE Engineering in Medicine and Biology Society},
  year={2006},
  pages={1986-1989}
}
  • Sunwoo Yuk, Shin-Woong Park, Yun Yi
  • Published in
    International Conference of…
    2006
  • Computer Science, Medicine
  • A 2D array radiation sensor, consisting of an array of PIN photodiodes bump bonded to readout integrated circuit (IC), has been developed for operation with low energy X-rays. The PIN photodiode array and readout IC for this system have been fabricated. The main performance measurements are the following: a few pA-scale leakage current, 350 pF junction capacitance, 30 mum-depth depletion layer and a 250 mum intrinsic layer at zero bias. This PIN photodiode array and readout IC were fabricated… CONTINUE READING

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