Design Optimization of Needle Geometry for Wafer-Level Probing Test

@article{Shih2009DesignOO,
  title={Design Optimization of Needle Geometry for Wafer-Level Probing Test},
  author={Meng-Kai Shih and Yi-Shao Lai},
  journal={IEEE Transactions on Components and Packaging Technologies},
  year={2009},
  volume={32},
  pages={435-439}
}
The probing test is a typical quality control method for individual chips on a wafer. With a proper design, the service life of probing needles in the probe card can be sufficiently elongated and hence reduces the testing cost. In this paper, we followed the Taguchi method with the L18(21 times 37) orthogonal array to obtain an optimal geometrical design of the probing needle based on the minimization of the scrub length the probe tip travels during a wafer-level probing test procedure… CONTINUE READING