Design And Fabrication Of SIO2 Micromechanical Structures Inside Anisotropically Etched Cavity

In the present work, we report a novel process for fabricating suspended silicon dioxide microstructures inside the anisotropically etched cavity formed in (100) silicon wafers. Using this new process, the moving parts are "recessed" in the substrate which can be packaged and handled easily compared to non-recessed structures. In the fabrication process… CONTINUE READING