Demographic Dividends: The Past, the Present, and the Future

@inproceedings{Mason2007DemographicDT,
  title={Demographic Dividends: The Past, the Present, and the Future},
  author={Andrew Mason},
  year={2007}
}
  • Andrew Mason
  • Published 2007
  • Economics
  • A chip scale package, which can be fabricated on a print circuit board, comprises a chip having multiple electrodes, a plurality of conductive blocks, and an insulating material. The electrodes of the chip are electrically connected to the conductive blocks respectively through one of the surfaces thereof by a conductive bond, and are electrically connected to the circuit on the print circuit board through the side surfaces thereof. The insulated material is filled on the chip surface between… CONTINUE READING

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