Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field

@inproceedings{Kawai2014DelaminationCI,
  title={Delamination crack initiation from copper/silicon nitride interface edge with nanoscale singular stress field},
  author={Emi Kawai and Kazunori Sanada and Takashi Sumigawa and Takayuki Kitamura},
  year={2014}
}
Abstract In order to investigate delamination crack initiation from an interfacial edge in nanoscale component with the singular stress field, we conduct mechanical experiments using four kinds of cantilever specimens with the nanoscale singular stress field at the copper/silicon nitride interface. The results reveal that regardless of the specimen dimensions, the critical magnitude of the plastic stress intensity parameter, K interface edge (C) , is constant (112 MPa m 0.179 ) within the… CONTINUE READING