Deformation and fatigue behaviour of AuSn interconnects

  title={Deformation and fatigue behaviour of AuSn interconnects},
  author={Olaf Wittler and Heimo Walter and Russell Dudek and Wolfgang Faust and Wei Jun and Bruno Michel},
  journal={2006 8th Electronics Packaging Technology Conference},
The knowledge of deformation and fatigue behaviour is vital for understanding reliability problems and builds the basis for mechanical simulations, which quantify strains, stresses and even product life-times. The focus of this paper is the AuSn interconnect in the form of eutectic AuSn and fine pitch flip-chip interconnects consisting in this example of an Au-phase and a zetha-phase. In the fist place local elastic-plastic properties are analysed by nanoindentation giving information about the… CONTINUE READING


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