Defect-oriented non-intrusive RF test using on-chip temperature sensors

  title={Defect-oriented non-intrusive RF test using on-chip temperature sensors},
  author={Louay Abdallah and Haralampos-G. D. Stratigopoulos and Salvador Mir and Josep Altet},
  journal={2013 IEEE 31st VLSI Test Symposium (VTS)},
We present a built-in, defect-oriented test approach for RF circuits that is based on thermal monitoring. A defect will change the power dissipation of the circuit under test from its expected range of values which, in turn, will induce a change in the expected temperature in the substrate near the circuit. Thus, an on-chip temperature sensor that monitors the temperature near the circuit can reveal the existence of the defect. This test approach has the key advantage of being non-intrusive and… CONTINUE READING
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Production Testing of RF and System-on-a- Chip Devices for Wireless Communications, Artech

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