Defect inspection of copper bonding using ultrasound

Abstract

Three dimensional packaging based on TSV is considered to be promising and has been accepted as the next generation technology for packaging. There are many advantages such as high speed interconnection, ultrafine pitch and high density integration. Copper bonding is one of the key bonding technologies to achieve 3D packaging with fine electrical… (More)

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Cite this paper

@article{Su2014DefectIO, title={Defect inspection of copper bonding using ultrasound}, author={Lei Su and Tielin Shi and Li Du and Pengfei Chen and Guanglan Liao and Xiangning Lu}, journal={2014 15th International Conference on Electronic Packaging Technology}, year={2014}, pages={858-861} }