Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language

@article{Borst2016DecompositionAO,
  title={Decomposition analysis of the multidisciplinary coupling in LED System-in-Package design using a DSM and a specification language},
  author={E. C. M. de Borst and L. F. P. Etman and A. W. J. Gielen and Albert T. Hofkamp and J. E. Rooda},
  journal={Structural and Multidisciplinary Optimization},
  year={2016},
  volume={53},
  pages={1395-1411}
}
LED System-in-Package (SiP) aims to reduce manufacturing and material costs of LED lighting products through integration of components into one single package, based on semiconductor technology. This introduces multidisciplinary coupling in the system behavior which requires reconsideration of the existing LED design decomposition practice. This paper presents our method to do a decomposition analysis of the multidisciplinary coupling structure for an industry scale LED SiP design problem. The… CONTINUE READING
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