Damascene processing using dielectric barrier films

@inproceedings{2001DamascenePU,
  title={Damascene processing using dielectric barrier films},
  author={양카이 and 어브대럴엠. and 왕훼이},
  year={2001}
}
Damascene process is achieved for reduced contact resistance and improved surface coverage of a dielectric barrier layer (50, 90, 91). Embodiments include the use of two different dielectric films (50, 31) to avoid mismatch problems. Examples further include the damascene copper metal using a localization (100) (100A, 100B) processes.