DRIE trenches and full-bridges design for sensitivity improvement of MEMS silicon thermal wind sensor

In this paper, a micromachined silicon thermal wind sensor with improved sensitivity is demonstrated. Deep reactive ion etching (DRIE) trenches are fabricated to suppress the lateral heat conduction between the heater and the thermistors. Moreover, two Wheatstone full-bridges consisting of eight thermistors are designed to increase the output voltage by 50… (More)