DBIT-direct backside interconnect technology: a manufacturable, bond wire free interconnect technology for microwave and millimeter wave MMICs

@article{Kazior1997DBITdirectBI,
  title={DBIT-direct backside interconnect technology: a manufacturable, bond wire free interconnect technology for microwave and millimeter wave MMICs},
  author={T. E. Kazior and H. N. Atkins and Ali M. Fatemi and Y. Chen and F. Colomb and J. Wendler},
  journal={1997 IEEE MTT-S International Microwave Symposium Digest},
  year={1997},
  volume={2},
  pages={723-726 vol.2}
}
A novel, highly manufacturable, low loss interconnect technique-DBIT (Direct Backside Interconnect Technology)-is presented. Polymer bumps are used to provide RF and ground interconnects between the backside of the MMIC chip and the substrate. The RF interconnects have been characterized up to 40 GHz. Measured interconnections have a 24 GHz bandwidth with 0… CONTINUE READING