Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling

Abstract

Mechanical cross-section polishing has traditionally been the method of choice for preparing samples to be examined by scanning electron microscopy (SEM). Although mechanical polishing, allied to selective chemical etching can reveal the most important characteristics of solder joint microstructure, subtle details may be lost. A relatively new cross section… (More)

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