Critical Dimension and Real-Time Temperature Control for Lithography

Abstract

In this paper, we present the experimental results on Critical Dimension (CD) control via real-time temperature control for warped wafers. As opposed to run-to-run control where information from the previous wafer or batch is used for control of the current wafer or batch, the approach here is real-time and make use of current information for control of the current wafer CD. In this paper we demonstrate that real-time control of the post-exposure bake temperature to give nonuniform temperature distribution across the warped wafer can reduce CD nonuniformity across the wafer.

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Cite this paper

@inproceedings{Ho2008CriticalDA, title={Critical Dimension and Real-Time Temperature Control for Lithography}, author={Weng Khuen Ho and Arthur Tay and Jun Fu and Ming Chen and Yong Feng}, year={2008} }