108 Citations
A newly developed rapid uniform thermal cycle test system for electronic components
- Engineering, Computer Science
- Microelectron. Reliab.
- 2017
- 2
Verification of Equation for Evaluating Dislocation Density during Steady-state Creep of Metals
- Materials Science
- 2017
- 3
- PDF
A Modified Theta Projection Model for Creep Behavior of Metals and Alloys
- Materials Science
- Journal of Materials Engineering and Performance
- 2016
- 10
A detailed appraisal of the stress exponent used for characterizing creep behavior in metallic glasses
- Materials Science
- 2016
- 11
Creep behavior of nanocrystalline Au films as a function of temperature
- Materials Science
- Journal of Materials Science
- 2016
- 11
Features of pore formation in welded joints of steam lines in long-term operation
- Materials Science
- 2016
- 3
- PDF
Structural Evolution and Mechanical Properties of a VT22 Titanium Alloy Under High-Temperature Deformation
- Materials Science
- 2016
- 9
Changes in Estimated Dislocation Density during Creep in Martensitic Heat-Resistant Steel
- Materials Science
- 2015
- 5
- PDF
References
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