Covalent Bonding of Organic Molecules to Cu and Al Alloy 2024 T3 Surfaces via Diazonium Ion Reduction

  title={Covalent Bonding of Organic Molecules to Cu and Al Alloy 2024 T3 Surfaces via Diazonium Ion Reduction},
  author={Belinda Hurley and Richard L. McCreery},
  journal={Journal of The Electrochemical Society},
  • B. HurleyR. McCreery
  • Published 1 May 2004
  • Materials Science, Chemistry
  • Journal of The Electrochemical Society
Cu surfaces and polished aluminum alloy 2024 T3 substrates were derivatized at open-circuit potential with aryl diazonium salts in both aprotic and aqueous media. Raman spectroscopy confirmed the presence of a derivatized film on the substrates before and after exposure to boiling water and sonication in acetone. Two different Cu substrate surfaces were prepared and used for X-ray photoelectron spectroscopy (XPS) analysis of the derivatization results. One surface was native oxide Cu… 

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