Cost-driven 3D design optimization with metal layer reduction technique

Abstract

Three-dimensional integrated circuit (3D IC) is a promising solution to continue the performance scaling. However, the fabrication cost for 3D ICs can be a major concern for the adoption of this emerging technology. In this paper, we study the cost implication for both TSV-based and interposer-based 3D ICs, with the observation that many long metal… (More)
DOI: 10.1109/ISQED.2013.6523625

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