Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

@article{Song2006CorrosionOS,
  title={Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability},
  author={Fubin Song and S. W. R. Lee},
  journal={56th Electronic Components and Technology Conference 2006},
  year={2006},
  pages={8 pp.-}
}
The drive for lead-free solders in the microelectronics industry presents some new reliability challenges. Sn-Ag-Cu alloys are leading candidates for lead-free solders. Compared to traditional Sn-Pb solders, Sn-Ag-Cu solders are easily corroded in corrosive environment due to their special structure. The presence of Ag3Sn in Sn-Ag-Cu solders accelerates the… CONTINUE READING