Corrosion behavior of 64Sn-35Bi-1Ag solder doped with Zn in NaCl solution and its electrochemical migration characteristics in high humid thermal condition for electronic packaging

@article{Hua2011CorrosionBO,
  title={Corrosion behavior of 64Sn-35Bi-1Ag solder doped with Zn in NaCl solution and its electrochemical migration characteristics in high humid thermal condition for electronic packaging},
  author={Lin Hua and Jianlei Zhang},
  journal={2011 12th International Conference on Electronic Packaging Technology and High Density Packaging},
  year={2011},
  pages={1-6}
}
Due to lead-free pressure, Sn-Bi-Ag solder (SBA) is regarded as an another potential substitute [1. However, low mechanical strength restricts its wide application. Metal doping can improve its mechanical characteristics and soldering strength. In this thesis, Zn doping in 64Sn-35Bi-lAg solder is discussed. Effect of Zn doping on corrosion behavior of lead-free SBA solder in 3 wt.% NaCl solution is investigated by potentiodynamic polarization. The electrochemical migration (ECM) causing to nano… CONTINUE READING

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