Copper trace cracking of BGA packages under die perimeter: combined effect of mold compound and die attach materials

@article{Chungpaiboonpatana2004CopperTC,
  title={Copper trace cracking of BGA packages under die perimeter: combined effect of mold compound and die attach materials},
  author={Surasit Chungpaiboonpatana and F. G. Shi},
  journal={IEEE Transactions on Device and Materials Reliability},
  year={2004},
  volume={4},
  pages={467-481}
}
This research examines the combined effect of mold and epoxy die attach materials on the cracking formation of fine copper traces routed under the die perimeters of plastic BGA packages, and under different thermal ramping rates. A designed plastic BGA package with specific traces routed and coupled with the active silicon device procured is used. The… CONTINUE READING