Copper electrodeposition for 3D integration

@article{Beica2008CopperEF,
  title={Copper electrodeposition for 3D integration},
  author={Rozalia Beica and Charles Sharbono and Tom Ritzdorf},
  journal={2008 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS},
  year={2008},
  pages={127-131}
}
Two dimensional (2D) integration has been the traditional approach for IC integration. Increasing demands for providing electronic devices with superior performance and functionality in more efficient and compact packages has driven the semiconductor industry to develop more advanced packaging technologies. 
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