Copper Wafer Bonding

@article{Fan1999CopperWB,
  title={Copper Wafer Bonding},
  author={Andy Fan and A. Rahman and Rafael Reif},
  journal={Electrochemical and Solid State Letters},
  year={1999},
  volume={2},
  pages={534-536}
}
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215 Citations
Highly Influential Citations
3
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44
Methods Citations
26
Results Citations
1

215 Citations

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Citation Type

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