Copper Wafer Bonding

@article{Fan1999CopperWB,
  title={Copper Wafer Bonding},
  author={Andy Fan and A. Rahman and Rafael Reif},
  journal={Electrochemical and Solid State Letters},
  year={1999},
  volume={2},
  pages={534-536}
}
Technology, performance, and computer-aided design of three-dimensional integrated circuits
TLDR
The overall 3D integration process flow is discussed, as well as specific technological challenges and the issues they present to circuit designers and how these issues may be tackled during the placement, routing, and layout stages of physical design.
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