Copper Wafer Bonding

@article{Fan1999CopperWB,
  title={Copper Wafer Bonding},
  author={Andy Fan and A. Rahman and Rafael Reif},
  journal={Electrochemical and Solid State Letters},
  year={1999},
  volume={2},
  pages={534-536}
}
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213 Citations
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3
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46
Methods Citations
28
Results Citations
1

213 Citations

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The recent semiconductor packaging technology is evolving into a high-performance system-in-packaging (SIP) structure, and copper-to-copper bonding process becomes an important core technology to…
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