209 Citations
Copper to copper bonding by nano interfaces for fine pitch interconnections and thermal applications
- Materials Science
- 2008
- Highly Influenced
A novel approach for forming ductile Cu-to-Cu interconnection
- Materials Science
- 2016 International Conference on Electronics Packaging (ICEP)
- 2016
- Highly Influenced
Technology, performance, and computer-aided design of three-dimensional integrated circuits
- Computer Science
- ISPD '04
- 2004
- 148
- PDF
Effects of two-step plasma treatment on Cu and SiO2 surfaces for 3D bonding applications
- Materials Science
- 2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
- 2020
Synthesis of copper and copper oxide nanomaterials by electrical discharges in water with various electrical conductivities
- Materials Science
- 2020
- 4
Characterization of Nitride Passivated Cu Surface for Low-Temperature Cu-Cu Bonding
- Materials Science, Computer Science
- 2019 International 3D Systems Integration Conference (3DIC)
- 2019
- 1