Copper Wafer Bonding

@article{Fan1999CopperWB,
  title={Copper Wafer Bonding},
  author={A. Fan and A. Rahman and R. Reif},
  journal={Electrochemical and Solid State Letters},
  year={1999},
  volume={2},
  pages={534-536}
}
  • A. Fan, A. Rahman, R. Reif
  • Published 1999
  • Materials Science
  • Electrochemical and Solid State Letters
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