Cooling three-dimensional integrated circuits using power delivery networks

Our comprehensive analysis, over a range of 3D integration methods and application power density characteristics, quantifies major benefits of PDNs on the temperature distribution of 3D ICs. For example, PDNs can reduce the maximum steady-state temperature by over 35 °C for a 2-layer monolithic 3D IC. Our OpenSPARC T2 case study also demonstrates that the… (More)