Cooling method for high power dissipation SMD packages


Using SMD packages with high power dissipation is challenging. To cool the SMD power packages, the state of the art solution is to use a PCB with thermal vias to extract the heat from the electronic package [1]. This solution has the disadvantage that the thermal resistance from package to heatsink is relatively high, in the range of 5–10 K/W. A new… (More)


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