Contamination Considerations For Perfluoroelastomer Seals Used In Deposition Processes

Deposition processes i.e., HDPCVD, PECVD, SACVD, ALD, etc., primarily operate at elevated temperatures and involve reactive gases and plasmas for both deposition and/or chamber cleaning. The trend towards larger semiconductor wafers, smaller feature sizes and decreasing thickness of deposited layers has placed increased emphasis on the need to minimize or… CONTINUE READING