Contact testing of copper micro-pillars with very low damage for 3D IC assembly

@article{Yaglioglu2013ContactTO,
  title={Contact testing of copper micro-pillars with very low damage for 3D IC assembly},
  author={Onnik Yaglioglu and Ben Eldridge},
  journal={2013 IEEE International 3D Systems Integration Conference (3DIC)},
  year={2013},
  pages={1-4}
}
3D IC integration offers a new paradigm of system assembly, which enables further miniaturization and new architectures driven mostly by the next generation mobile electronics applications which require larger bandwidth, lower power consumption, smaller footprints and reduced cost. However, 3D integration presents test challenges and demands new test… CONTINUE READING