Constitutive modeling of lead-free solders

  title={Constitutive modeling of lead-free solders},
  author={Min Pei and Jiamnin Qu},
  journal={Proceedings. International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, 2005.},
  • Min Pei, Jiamnin Qu
  • Published 2005 in
    Proceedings. International Symposium on Advanced…
Solders are used extensively as electrical interconnects in microelectronics packaging. Because of environmental concerns, lead-based solders are being replaced by Sn/Ag and Sn/Ag/Cu based solder materials. Since the thermomechanical reliability of modern electronic devices depends on, to a large extent, the fatigue and creep behavior of the solder joints, it is imperative to understand the deformation behavior of these new lead-free solders. This study conducted extensive thermomechanical… CONTINUE READING
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