Confrontation of failure mechanisms observed during Active Power Cycling tests with finite element analyze performed on a MOSFET power module

Abstract

A new type of assembly and interconnection technology in power modules has been developed to connect MOSFETs. These power modules, used as frequency inverters for electric feature, have an innovative design. They avoid using aluminum wire bond, often to be blamed for device failure, by using a copper clip soldered on the top side of the chip. The successful… (More)

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@article{Durand2013ConfrontationOF, title={Confrontation of failure mechanisms observed during Active Power Cycling tests with finite element analyze performed on a MOSFET power module}, author={C. Durand and M. Klingler and Daniel Coutellier and Hakim Naceur}, journal={2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)}, year={2013}, pages={1-4} }