Conductive anodic filament reliability and failure analysis for halogen-free packaging substrate

Abstract

Conductive anodic filament (CAF) formation, a failure mode in printed circuit boards (PCBs), which has been reported in 1976, has caused catastrophic field failures on electronic product. With the trend of high circuit density demands in organic packages, the pitch of plated through holes (PTHs) in packages should be reduced, and the amount of CAF failures… (More)

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