Conductive Adhesives: Alternative to High Temperature Solders and The Future

  • Kunie Suganuma
  • Published 2007 in
    Polytronic 2007 - 6th International Conference on…

Abstract

Isotropic conductive adhesives have excellent attributes as heat-resistant lead-free high temperature interconnection materials as well as those enabling low temperature manufacturing of circuits. Ag metallic particles from nano-scale to micron-scale are combined with organic matrix to provide sound high-temperature lead-free interconnection. Micron-sized… (More)

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