Concurrent Chip and Package Design for Radio and Mixed-Signal Systems

@inproceedings{Shen2005ConcurrentCA,
  title={Concurrent Chip and Package Design for Radio and Mixed-Signal Systems},
  author={Meigen Shen},
  year={2005}
}
The advances in VLSI and packaging technologies enable us to integrate a whole system on a single chip (SoC) or on a package module. In these systems, analog/RF electronics, digital circuitries, and memories coexist. This new technology brings us new freedom for system integration as well as new challenges in system design and implementation. To fully… CONTINUE READING