Computational simulation of electromigration induced damage in copper interconnects

@inproceedings{Basaran2007ComputationalSO,
  title={Computational simulation of electromigration induced damage in copper interconnects},
  author={Cemal Basaran and Minghui Lin and Shidong Li},
  booktitle={SCSC},
  year={2007}
}

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Electromigration induced stress in through-silicon-via (TSV)

2013 14th International Conference on Electronic Packaging Technology • 2013
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