Comparison of the electromigration behaviors between micro-bumps and C4 solder bumps

Abstract

As flip chip packages continue to migrate to Pb-free solder and micro-bumping (μbump) for 3D IC stacking, achieving high reliability with reduced dimension and concurrent increase in current density has become one of the major challenges for microelectronic packaging systems. In this study, the electromigration (EM) performance of the nominal C4 and μbump… (More)

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